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반도체의 부가가치를 올리는 패키지와 테스트

서민석 (지은이) | 한올출판사
  • 등록일2023-03-13
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책소개

이 책은 반도체 패키지와 테스트의 입문서입니다. 반도체 업계에 입문하려는 학생들에게는 방향을 제시하는 지침서의 역할을 하 게 될 것입니다. 또한 패키지와 테스트 관련 업무에 종사하는 분들과 유관 업무를 하고 계신 분 들에게는 이해도를 향상시켜드리게 될 것입니다. 나아가 패키지, 테스트의 장비와 소재를 만드는 분들에게도 이 책의 지식들이 해 당 업무의 효율을 높이는 데 기여할 것이라 생각됩니다.

목차

01 반도체 테스트의 이해



01.  반도체 후공정 ······················································ 5

02.  테스트의 종류······················································ 8

03.  웨이퍼 테스트 ···················································· 10

EPM ································································ 13

웨이퍼 번인······················································· 13

테스트 ····························································· 14

리페어······························································ 15

04.  패키지 테스트 ···················································· 16

TDBI································································ 17

테스트 ····························································· 18

외관 검사·························································· 18



02 반도체 패키지의 정의와 역할



01.  반도체 패키지의 정의········································· 25

02.  반도체 패키지의 역할 ········································ 26

03.  반도체 패키지의 개발 트렌드····························· 28

04.  반도체 패키지 개발 과정 ··································· 31



03 반도체 패키지의 종류



01.  반도체 패키지의 분류······················································ 39

02.  컨벤셔널 패키지·······························································41

플라스틱 패키지 - 리드프레임 타입 패키지··························41

플라스틱 패키지 - 서브스트레이트 타입 패키지 ·················· 43

세라믹 패키지 ································································ 46

03.  웨이퍼 레벨 패키지························································· 47

웨이퍼 레벨 패키지 ························································· 47

재배선··········································································· 56

플립 칩·········································································· 58

04.  적층 패키지····································································· 66

패키지 적층 ··································································· 67

칩 적층 - Chip Stack with Wire Bonding··························· 70

실리콘 관통 전극 - Chip Stack with TSV ··························· 73

05.  시스템 인 패키지····························································· 86



04 반도체 패키지 설계와 해석



01.  반도체 패키지 설계 ························································· 97

02.  구조 해석······································································· 101

휨 해석········································································ 104

솔더 접합부 신뢰성 ······················································· 106

강도 해석····································································· 108

03.  열 해석 ·········································································· 109

04.  전기 해석 ······································································113



05 반도체 패키지 공정



01.  컨벤셔널 패키지 공정·······································123

백 그라인딩 ····················································124

웨이퍼 절단·····················································127

다이 어태치 ····················································131

인터커넥션······················································137

몰딩·······························································143

마킹·······························································144

트리밍 – 리드프레임·········································146

솔더 도금 – 리드프레임·····································147

성형 – 리드프레임············································147

솔더 볼 마운팅 – 서브스트레이트 ·······················148

싱귤레이션 - 서브스트레이트 ····························152

02.  웨이퍼 레벨 패키지 공정··································153

포토 공정 ·······················································156

스퍼터링 공정 ················································· 161

전해도금 공정 ·················································163

습식 공정 – PR 스트립과 금속 에칭 ····················166

팬인 WLCSP 공정············································167

솔더 볼 마운팅 공정·········································168

플립 칩 범프 공정 ············································169

재배선 공정 ····················································171

팬아웃 WLCSP 공정·········································172

실리콘 관통 전극 패키지 공정···························· 174

03.  검사와 측정······················································187

검사·······························································187

측정·······························································192



06 반도체 패키지 재료



01.  컨벤셔널 패키지 재료···················································· 208

리드프레임 ·································································· 208

서브스트레이트···························································· 210

접착제········································································· 217

에폭시 몰딩 컴파운드···················································· 222

솔더 ··········································································· 225

테이프········································································· 228

와이어 ········································································ 229

포장 재료 ···································································· 230

02.  웨이퍼 레벨 패키지 재료··············································· 231

포토 레지스트 ······························································ 231

도금 용액····································································· 234

PR 스트립퍼································································· 235

에천트········································································· 237

스퍼터 타깃 ································································· 238

언더필········································································· 238

캐리어와 접착제, 마운팅 테이프······································ 240



07 반도체 패키지 신뢰성



01.  신뢰성 의미 ··································································· 247

02.  JEDEC 기준··································································· 248

03.  수명 신뢰성 시험··························································· 253

EFR ············································································ 253

HTOL ········································································· 254

LTOL ·········································································· 255

HTSL ·········································································· 256

LTSL··········································································· 257

Endurance ····················································· 257

Data Retention··············································· 258

04.  환경 신뢰성 시험·············································· 259

Preconditioning·············································· 259

TC ································································· 263

TS ································································· 268 THS······························································· 268 PCTP······························································269

UHAST ·························································· 270 HAST····························································· 271 HALT····························································· 272

05.  기계적 신뢰성 시험·········································· 273

충격································································274

진동······························································· 275

구부림 ··························································· 275

비틀림·····························································276



08 반도체 용어해설



용어해설·································································· 282

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